SiP Market Outlook: Why Asia Pacific Leads the Global Race
The global system-in-package market is likely to be valued at US$ 13.9 Bn in 2025 and reach US$ 26.0 Bn by 2032, growing at a CAGR of 9.4% in the forecast period from 2025 to 2032. The system-in-package market is shifting toward advanced 2.5D and 3D integration, driven by AI, 5G, and EV demand. Geopolitical shifts and localization efforts are accelerating regional manufacturing and investment in high-performance, compact semiconductor packaging solutions.